ELECTRONIC COMPONENT PACKAGE, ELECTRONIC COMPONENT

专利名称：ELECTRONIC COMPONENT PACKAGE,

ELECTRONIC COMPONENT MOUNTEDAPPARATUS, METHOD OF INSPECTINGBONDING PORTION THEREIN, AND CIRCUITBOARD

发明人：Seiji TOKII申请号：US12107454申请日：20080422

公开号：US20080266825A1公开日：20081030

专利附图：

摘要：An electronic component package includes: an insulating carrier substrate; aconnection wiring that is provided on one side of the carrier substrate; an IC chip that isconnected to the connection wiring; an external connection land that is disposed on theother side of the carrier substrate and is connected to the connection wiring via a wiringin the carrier substrate; and a solder ball that is disposed on the external connectionland. A region of the external connection land that can be bonded to the solder ball hasan outer shape that includes at least one arc portion and at least one straight portion.With this configuration, it is possible to provide an electronic component mountedapparatus in which bonding failure of the external connection land and the circuit board-side land with the solder ball can be reduced, and the bonding state can be easilyinspected, and a method of inspecting a bonding portion therein.

申请人：Seiji TOKII

地址：Hyogo JP

国籍：JP

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