专利名称：Injection molded solder bumping发明人：Toyohiro Aoki,Takashi Hisada,Eiji
Nakamura,Kuniaki Sueoka
申请号：US15454229申请日：20170309公开号：US10037967B1公开日：20180731
专利附图：
摘要：Methods for depositing material on a chip include forming a mold layer on asubstrate. The mold layer has one or more openings over respective contact areas on thesubstrate. The one or more openings are formed from an upper volume and a lower
volume, the upper volume having a smaller diameter than a diameter of the lowervolume. A material is injected into the one or more openings under pressure, such thatgas trapped in the one or more openings displaces into the lower volume until theinjected material in the one or more openings makes contact with each respective contactarea.
申请人：INTERNATIONAL BUSINESS MACHINES CORPORATION
地址：Armonk NY US
国籍：US
代理机构：Tutunjian & Bitetto, P.C.
代理人：Vazken Alexanian
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