High speed die transfer system and method

专利名称：High speed die transfer system and method发明人：Kruger, Johan Dawid申请号：EP00303010.3申请日：20000410公开号：EP1043925A3公开日：20010523

专利附图：

摘要：A system 10 for automatically transferring a plurality of devices onto a pluralityof circuits comprises a main drum 22 for feeding a continuous substrate 20 comprising aplurality of circuits 14.1 to 14.n provided thereon. The circuits collectively provide a firstset of positions being respective device placement positions for receiving devices. A

device transfer drum 34 cooperates with the main drum to transfer the devices onto thesubstrate in a device transfer region 48. The device transfer drum comprises means forcarrying the devices in a second set of positions, respective ones of the first set ofpositions being associated with respective ones of the second set of positions. Thesystem also comprises drive means 31 for driving the main drum 34 and the devicetransfer drum such that sequential positions in the first set of positions are in registerwith their associated positions in the second set of positions in said device transferregion, to transfer the devices onto the substrate in the respective device placementpositions.

申请人：Supersensor (Proprietary) Limited

地址：First Floor, M-Net Park Goodwood 7460 ZA

国籍：ZA

代理机构：Pratt, David Martin

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