专利名称：INJECTION MOLDED SOLDER BUMPING发明人：Toyohiro Aoki,Takashi Hisada,Eiji
Nakamura,Kuniaki Sueoka
申请号：US15988351申请日：20180524
公开号：US20180277509A1公开日：20180927
专利附图：
摘要：Methods for depositing material on a chip include forming a mold layer. Themold layer includes one or more openings over respective contact areas, each of the oneor more openings having an upper volume and a lower volume. The upper volume has a
smaller diameter than a diameter of the lower volume. Each contact area is within therespective lower volume. A material is injected into the one or more openings underpressure.
申请人：INTERNATIONAL BUSINESS MACHINES CORPORATION
地址：Armonk NY US
国籍：US
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容
Copyright © 2019- nryq.cn 版权所有 赣ICP备2024042798号-6
违法及侵权请联系：TEL:199 1889 7713 E-MAIL:2724546146@qq.com
本站由北京市万商天勤律师事务所王兴未律师提供法律服务