专利名称：Method and apparatus for testing of
integrated circuit package
发明人：Carlo Grillettc申请号：US10727474申请日：20031204公开号：US06954082B2公开日：20051011
专利附图：
摘要：A method and apparatus for testing an integrated circuit (IC) package includes aprinted circuit board (PCB) on which is mounted the IC package and which is removablyconnected (preferably perpendicular) to a motherboard. The IC package, the PCB and
the motherboard are subjected to thermal, humidity and/or electrical test conditions.
申请人：Carlo Grillettc
地址：San Carlos CA US
国籍：US
代理人：L. Jon Lindsay
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容