专利名称：Improvements in or relating to electronic
packages
发明人：Abbott, John A.,Kalidas,
Navinchandra,Thompson, Raymond W.
申请号：EP96309224.2申请日：19961218公开号：EP0780896A3公开日：19990414
专利附图：
摘要：After completing this macro, return to each appropriate section and type theinformation provided by the attorney. In accordance with the invention, integrated circuit
dies may be packaged in a plastic package employing an area array technology such as aconductive ball grid array, column grid array or pin grid array. One aspect of the inventionis an integrated circuit package(10) which includes an electronic circuit enclosed by aplastic body (12, 14). The molded plastic body has a first major surface opposing asecond major surface. The first major surface of integrated circuit (10) has a plurality ofopenings therein. One of a plurality of conductive pads (18) is adjacent to each one of theopenings and is electrically connected to the electronic circuit. Each of a plurality ofconductors (20) is electrically connected to one of the pads (18) and protrudes from oneof the openings (22).
申请人：TEXAS INSTRUMENTS INCORPORATED
地址：13500 North Central Expressway Dallas Texas 75265 US
国籍：US
代理机构：Blanco White, Henry Nicholas
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