MOTOROLA捷多邦，您值得信赖的PCB打样专家！Order this documentby MBRB1545CT/DSEMICONDUCTOR TECHNICAL DATADesigner's™Data SheetSWITCHMODE™Power RectifierD2PAK Surface Mount Power PackageThe D2PAK Power Rectifier employs the Schottky Barrier principle with aplatinum barrier metal. These state-of-the-art devices have the followingfeatures:••••••••Center-Tap ConfigurationGuardring for Stress ProtectionLow Forward Voltage150°C Operating Junction TemperatureEpoxy Meets UL94, VO at 1/8″Guaranteed Reverse AvalancheShort Heat Sink Tab Manufactured — Not Sheared!Similar in Size to the Industry Standard TO-220 PackageMBRB1545CTMotorola Preferred DeviceSCHOTTKY BARRIERRECTIFIER15 AMPERES45 VOLTS41413CASE 418B-02D2PAKMechanical Characteristics•Case: Epoxy, Molded3•Weight: 1.7 grams (approximately)•Finish: All External Surfaces Corrosion Resistant and Terminal Leads areReadily Solderable•Lead and Mounting Surface Temperature for Soldering Purposes: 260°CMax. for 10 Seconds•Shipped 50 units per plastic tube•Available in 24 mm Tape and Reel, 800 units per 13″ reel by adding a “T4”suffix to the part number•Marking: B1545TMAXIMUM RATINGS, PER LEGRatingPeak Repetitive Reverse VoltageWorking Peak Reverse VoltageDC Blocking VoltageAverage Rectified Forward Current(Rated VR) TC = 105°CPeak Repetitive Forward Current(Rated VR, Square Wave, 20 kHz), TC = 105°CNon-repetitive Peak Surge Current(Surge applied at rated load conditions halfwave, single phase, 60 Hz)Peak Repetitive Reverse Surge Current (2.0 µs, 1.0 kHz)Storage TemperatureOperating Junction TemperatureVoltage Rate of Change (Rated VR)Total DeviceSymbolVRRMVRWMVRIF(AV)IFRMIFSMIRRMTstgTJdv/dtValue45UnitVolts7.515151501.0–65 to +175–65 to +15010000AmpsAmpsAmpsAmp°C°CV/µsTHERMAL CHARACTERISTICS, PER LEGThermal Resistance—Junction to Case—Junction to Ambient (1)(1)When mounted using minimum recommended pad size on FR-4 board.Designer’s Data for “Worst Case” Conditions—The Designer’s Data Sheet permits the design of most circuits entirely from the information presented. SOA Limitcurves—representing boundaries on device characteristics—are given to facilitate “worst case” design.RθJCRθJA2.050°C/WDesigner’s and SWITCHMODE are trademarks of Motorola, Inc.Thermal Clad is a trademark of the Bergquist CompanyPreferred devices are Motorola recommended choices for future use and best overall value.Rev 2©Rectifier Device Data Motorola, Inc. 19961MBRB1545CTELECTRICAL CHARACTERISTICS, PER LEGRatingMaximum Instantaneous Forward Voltage (2)(iF = 7.5 Amps, TJ = 125°C)(iF = 15 Amps, TJ = 125°C)(iF = 15 Amps, TJ = 25°C)Maximum Instantaneous Reverse Current (2)(Rated dc Voltage, TJ = 125°C)(Rated dc Voltage, TJ = 25°C)(2)Pulse Test: Pulse Width = 300 µs, Duty Cycle ≤2.0%.SymbolvFValue0.570.720.84mA150.1UnitVoltsiRiF, INSTANTANEOUS FORWARD CURRENT (AMPS)IR, REVERSE LEAKAGE CURRENT (mA)503020103210.5125°C85°C25°C10125°C185°C0.125°C0.010.10.20.30.40.50.60.70.8vF, INSTANTANEOUS FORWARD VOLTAGE (VOLTS)0.90.00101020304050VR, REVERSE VOLTAGE (VOLTS)Figure 1. Typical Forward Voltage, Per LegFigure 2. Typical Reverse Current, Per LegPF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS)141210864200TJ = 125°CIPK= 10IAVIPK= 5IAVIPK= πIAVIF(AV), AVERAGE FORWARD CURRENT (AMPS)16161412108642120125130135140145150TC, CASE TEMPERATURE (°C)155160SQUAREWAVEDCRATED VOLTAGE APPLIEDRθJC = 2°C/WIPK= 20IAVDCSQUAREWAVE2468101214IF(AV), AVERAGE FORWARD CURRENT (AMPS)16Figure 3. Typical Forward Power DissipationFigure 4. Current Derating, Case2Rectifier Device DataMBRB1545CTINFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGEMINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONSSurface mount board layout is a critical portion of the totaldesign. The footprint for the semiconductor packages must bethe correct size to insure proper solder connection interface0.7017.78between the board and the package. With the correct padgeometry, the packages will self align when subjected to asolder reflow process.0.06251.5870.45011.430.082.0320.3508.890.153.81inchesmmD2PAK POWER DISSIPATIONThe power dissipation of the D2PAK is a function of the drainpad size. This can vary from the minimum pad size forsoldering to a pad size given for maximum power dissipation.Power dissipation for a surface mount device is determined byTJ(max), the maximum rated junction temperature of the die,RθJA, the thermal resistance from the device junction toambient; and the operating temperature, TA. Using the valuesprovided on the data sheet for the D2PAK package, PD can becalculated as follows:PD =TJ(max) – TARθJAthe equation for an ambient temperature TA of 25°C, one cancalculate the power dissipation of the device which in this caseis 2.5 watts.PD =150°C – 25°C =2.5watts50°C/WThe values for the equation are found in the maximumratings table on the data sheet. Substituting these values intoThe 50°C/W for the D2PAK package assumes therecommended drain pad area of 158K mil2 on FR-4 glassepoxy printed circuit board to achieve a power dissipation of2.5 watts using the footprint shown. Another alternative is touse a ceramic substrate or an aluminum core board such asThermal Clad™. By using an aluminum core board materialsuch as Thermal Clad, the power dissipation can be doubledusing the same footprint.GENERAL SOLDERING PRECAUTIONSThe melting temperature of solder is higher than the ratedtemperature of the device. When the entire device is heatedto a high temperature, failure to complete soldering within ashort time could result in device failure. Therefore, thefollowing items should always be observed in order tominimize the thermal stress to which the devices aresubjected.•Always preheat the device.•The delta temperature between the preheat and solderingshould be 100°C or less.*•When preheating and soldering, the temperature of theleads and the case must not exceed the maximumtemperature ratings as shown on the data sheet. Whenusing infrared heating with the reflow soldering method,the difference shall be a maximum of 10°C.•The soldering temperature and time shall not exceed260°C for more than 5 seconds.•When shifting from preheating to soldering, the maximumtemperature gradient shall be 5°C or less.•After soldering has been completed, the device should beallowed to cool naturally for at least three minutes.Gradual cooling should be used as the use of forcedcooling will increase the temperature gradient and resultin latent failure due to mechanical stress.•Mechanical stress or shock should not be applied duringcooling*Soldering a device without preheating can cause excessivethermal shock and stress which can result in damage to thedevice.*Due to shadowing and the inability to set the wave height toincorporate other surface mount components, the D2PAK isnot recommended for wave soldering.Rectifier Device Data3MBRB1545CTRECOMMENDED PROFILE FOR REFLOW SOLDERINGFor any given circuit board, there will be a group of controlsettings that will give the desired heat pattern. The operatormust set temperatures for several heating zones, and a figurefor belt speed. Taken together, these control settings make upa heating “profile” for that particular circuit board. Onmachines controlled by a computer, the computer remembersthese profiles from one operating session to the next. Figure5 shows a typical heating profile for use when soldering theD2PAK to a printed circuit board. This profile will vary amongsoldering systems but it is a good starting point. Factors thatcan affect the profile include the type of soldering system inuse, density and types of components on the board, type ofsolder used, and the type of board or substrate material beingused. This profile shows temperature versus time. The line onthe graph shows the actual temperature that might beexperienced on the surface of a test board at or near a centralsolder joint. The two profiles are based on a high density anda low density board. The Vitronics SMD310 convection/in-frared reflow soldering system was used to generate thisprofile. The type of solder used was 62/36/2 Tin Lead Silverwith a melting point between 177–189°C. When this type offurnace is used for solder reflow work, the circuit boards andsolder joints tend to heat first. The components on the boardare then heated by conduction. The circuit board, because ithas a large surface area, absorbs the thermal energy moreefficiently, then distributes this energy to the components.Because of this effect, the main body of a component may beup to 30 degrees cooler than the adjacent solder joints.STEP 1PREHEATZONE 1“RAMP”STEP 2STEP 3VENTHEATING“SOAK”ZONES 2 & 5“RAMP”STEP 4HEATINGZONES 3 & 6“SOAK”STEP 5HEATINGZONES 4 & 7“SPIKE”STEP 6VENTSTEP 7COOLING200°CDESIRED CURVE FOR HIGHMASS ASSEMBLIES150°C150°C160°C170°C205° TO 219°CPEAK ATSOLDER JOINT100°C100°C140°CSOLDER IS LIQUID FOR40 TO 80 SECONDS(DEPENDING ONMASS OF ASSEMBLY)DESIRED CURVE FOR LOWMASS ASSEMBLIES50°CTIME (3 TO 7 MINUTES TOTAL)TMAXFigure 5. Typical Solder Heating Profile for D2PAK4Rectifier Device DataMBRB1545CTPACKAGE DIMENSIONSCEB4DIMABCDEGHJKSVVNOTES:1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: INCH.INCHESMINMAX0.3400.3800.3800.4050.1600.1900.0200.0350.0450.0550.100 BSC0.0800.1100.0180.0250.0900.1100.5750.6250.0450.055MILLIMETERSMINMAX8.649.659.6510.294.064.830.510.891.141.402.54 BSC2.032.790.460.642.292.7914.6015.881.141.40A123S–T–SEATINGPLANEKGD3 PL0.13 (0.005)HMJTCASE 418B–02ISSUE BSTYLE 3:PIN 1.2.3.4.ANODECATHODEANODECATHODERectifier Device Data5MBRB1545CTMotorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, andspecifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motoroladata sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights ofothers. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or otherapplications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injuryor death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorolaand its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney feesarising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges thatMotorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an EqualOpportunity/Affirmative Action Employer.Mfax is a trademark of Motorola, Inc.How to reach us:USA/EUROPE/Locations Not Listed: Motorola Literature Distribution;P.O. Box 5405, Denver, Colorado 80217. 303–675–2140 or 1–800–441–2447Mfax™: RMFAX0@email.sps.mot.com – TOUCHTONE 602–244–6609INTERNET: http://Design–NET.comJAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center,3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 81–3–3521–8315ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–266292986◊CODELINE TO BE PLACED HERERectifier Device DataMBRB1545CT/D