LED封装所有技术名称

LED封装技术分为哪几类？

LED封装技术种类比较繁多。他们分别为。

1·LQFP封装(lowprofilequadflatpackage) 2·L-QUAD封装

3·MCM封装(multi-chipmodule) 4·MFP封装(miniflatpackage) 5·MQFP封装(metricquadflatpackage) 6·MQUAD封装(metalquad)

7·MSP封装(minisquarepackage) 8·OPMAC封装(overmoldedpadarraycarrier) 9·P-(plastic)封装 10·PAC封装(padarraycarrier) 11·PCLP(printedcircuitboardleadlesspackage) 12·PFPF(plasticflatpackage) 13·PGA(pingridarray) 14·PiggyBack

15·DIL(dualin-line)DIP的别称(见DIP)。 16·DIP(dualin-linepackage)双列直插式封装 17·DSO(dualsmallout-lint) 18·DICP(dualtapecarrierpackage) 19·DIP(dualtapecarrierpackage) 20·FP(flatpackage)

21·Flip-chip 22·FQFP(finepitchquadflatpackage) 23·CPAC(globetoppadarraycarrier)

24·CQFP軍用晶片陶瓷平版封裝(CeramicQuadFlat-packPackage)

25·H-(withheatsink) 26·PinGridArray(SurfaceMountType) 27·JLCC封装(J-leadedchipcarrier) 28·LCC封装(Leadlesschipcarrier) 29·LGA封装(landgridarray) 30·LOC封装(leadonchip) 31·DIC(dualin-lineceramicpackage) 32·DFP(dualflatpackage)

33·COB封装(chiponboard) 34·CLCC封装(ceramicleadedchipcarrier) 35·Cerquad封装 36·Cerdip封装

37·C-(ceramic)封装 38·碰焊PGA封装(buttjointpingridarray) 39·BQFP封装(quadflatpackagewithbumper) 40·BGA封装(ballgridarray)